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(Invited) Wafer Bonding for the Manufacture of High-Brightn..:
Plößl, Andreas E.
;
Baur, Johannes
;
Eißler, Dieter
...
ECS Transactions. 33 (2010) 4 - p. 613-624 , 2010
Link:
https://doi.org/10.1149/1.3483553
RT Journal T1
(Invited) Wafer Bonding for the Manufacture of High-Brightness and High-Efficiency Light-Emitting Diodes
UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.3483553&Exemplar=1&LAN=DE A1 Plößl, Andreas E. A1 Baur, Johannes A1 Eißler, Dieter A1 Engl, Karl A1 Härle, Volker A1 Hahn, Berthold A1 Heindl, Alexander A1 Illek, Stefan A1 Klemp, Christoph A1 Rode, Patrick A1 Streubel, Klaus A1 Tangrin, Ivar PB The Electrochemical Society YR 2010 SN 1938-5862 SN 1938-6737 JF ECS Transactions VO 33 IS 4 SP 613 OP 624 LK http://dx.doi.org/https://doi.org/10.1149/1.3483553 DO https://doi.org/10.1149/1.3483553 SF ELIB - SuUB Bremen
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