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1 Ergebnisse
1
Wafer Backside Arcing Prevention in SIP Ti/TiN Process:
Huang, Hupin
;
Lin, Paul-Chang
;
Gui, Kun
...
ECS Transactions. 44 (2012) 1 - p. 505-509 , 2012
Link:
https://doi.org/10.1149/1.3694361
RT Journal T1
Wafer Backside Arcing Prevention in SIP Ti/TiN Process
UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.3694361&Exemplar=1&LAN=DE A1 Huang, Hupin A1 Lin, Paul-Chang A1 Gui, Kun A1 Wang, William A1 Li, Terry A1 Ji, Justin A1 Jiang, Jian-Yong PB The Electrochemical Society YR 2012 SN 1938-5862 SN 1938-6737 JF ECS Transactions VO 44 IS 1 SP 505 OP 509 LK http://dx.doi.org/https://doi.org/10.1149/1.3694361 DO https://doi.org/10.1149/1.3694361 SF ELIB - SuUB Bremen
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