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1 Ergebnisse
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Communication—Fast Bottom-Up Filling of High Aspect Ratio M..:
Wu, Houya
;
Li, Zhiyi
;
Wang, Yan
.
Journal of The Electrochemical Society. 167 (2020) 13 - p. 132507 , 2020
Link:
https://doi.org/10.1149/1945-7111/abbce5
RT Journal T1 <Title>Communication—Fast Bottom-Up Filling of High Aspect Ratio Micro Vias Using a Single CTAB Additive</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1945-7111_abbce5&Exemplar=1&LAN=DE A1 Wu, Houya A1 Li, Zhiyi A1 Wang, Yan A1 Zhu, Wenhui PB The Electrochemical Society YR 2020 SN 1945-7111 JF Journal of The Electrochemical Society VO 167 IS 13 SP 132507 LK http://dx.doi.org/https://doi.org/10.1149/1945-7111/abbce5 DO https://doi.org/10.1149/1945-7111/abbce5 SF ELIB - SuUB Bremen
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