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1 Ergebnisse
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Void-free Copper Electrodeposition in High Aspect Ratio, Fu..:
Schmitt, Rebecca P.
;
Menk, Lyle A.
;
Baca, Ehren
...
Journal of The Electrochemical Society. 167 (2020) 16 - p. 162517 , 2020
Link:
https://doi.org/10.1149/1945-7111/abd56e
RT Journal T1
Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection
UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1945-7111_abd56e&Exemplar=1&LAN=DE A1 Schmitt, Rebecca P. A1 Menk, Lyle A. A1 Baca, Ehren A1 Bower, John Eric A1 Romero, Joseph A. A1 Jordan, Matthew B. A1 Jackson, Nathan A1 Hollowell, Andrew E. PB The Electrochemical Society YR 2020 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 167 IS 16 SP 162517 LK http://dx.doi.org/https://doi.org/10.1149/1945-7111/abd56e DO https://doi.org/10.1149/1945-7111/abd56e SF ELIB - SuUB Bremen
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