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1 Ergebnisse
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Influences of Impurity Incorporation in Electroplated Cu on..:
Chen, Po-Kai
;
Li, Yu-Ju
;
Yen, Yee-Wen
.
Journal of The Electrochemical Society. 169 (2022) 5 - p. 052508 , 2022
Link:
https://doi.org/10.1149/1945-7111/ac7105
RT Journal T1 <Title>Influences of Impurity Incorporation in Electroplated Cu on the SnAgCu and Ni-Containing SnAgCu Solder Joints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1945-7111_ac7105&Exemplar=1&LAN=DE A1 Chen, Po-Kai A1 Li, Yu-Ju A1 Yen, Yee-Wen A1 Chen, Chih-Ming PB The Electrochemical Society YR 2022 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 169 IS 5 SP 052508 LK http://dx.doi.org/https://doi.org/10.1149/1945-7111/ac7105 DO https://doi.org/10.1149/1945-7111/ac7105 SF ELIB - SuUB Bremen
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