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Direct Wafer Bonding of SiC-SiC by SAB for Monolithic Integ..:
Mu, F.
;
Iguchi, K.
;
Nakazawa, H.
...
ECS Journal of Solid State Science and Technology. 5 (2016) 9 - p. P451-P456 , 2016
Link:
https://doi.org/10.1149/2.0011609jss
RT Journal T1 <Title>Direct Wafer Bonding of SiC-SiC by SAB for Monolithic Integration of SiC MEMS and Electronics</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0011609jss&Exemplar=1&LAN=DE A1 Mu, F. A1 Iguchi, K. A1 Nakazawa, H. A1 Takahashi, Y. A1 Fujino, M. A1 Suga, T. PB The Electrochemical Society YR 2016 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 5 IS 9 SP P451 OP P456 LK http://dx.doi.org/https://doi.org/10.1149/2.0011609jss DO https://doi.org/10.1149/2.0011609jss SF ELIB - SuUB Bremen
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