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Reliability Enhancement of Copper/Porous SiOCH Metallizatio..:
Fang, Jau-Shiung
;
Yu, Kuang-Yu
;
Chen, Sung-Te
...
ECS Journal of Solid State Science and Technology. 8 (2019) 12 - p. N208-N213 , 2019
Link:
https://doi.org/10.1149/2.0011912jss
RT Journal T1 <Title>Reliability Enhancement of Copper/Porous SiOCH Metallization Systems Using Nitrogen Stuffing and Bias-Filter Sputter Deposited Mn2O3 Barrier</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0011912jss&Exemplar=1&LAN=DE A1 Fang, Jau-Shiung A1 Yu, Kuang-Yu A1 Chen, Sung-Te A1 Cheng, Yi-Lung A1 Wang, Yi-Sheng A1 Chen, Giin-Shan PB The Electrochemical Society YR 2019 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 8 IS 12 SP N208 OP N213 LK http://dx.doi.org/https://doi.org/10.1149/2.0011912jss DO https://doi.org/10.1149/2.0011912jss SF ELIB - SuUB Bremen
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