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The Polishing Effect of SiC Substrates in Femtosecond Laser..:
Wang, Chengwu
;
Kurokawa, Syuhei
;
Doi, Toshiro
...
ECS Journal of Solid State Science and Technology. 6 (2017) 4 - p. P105-P112 , 2017
Link:
https://doi.org/10.1149/2.0041704jss
RT Journal T1 <Title>The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0041704jss&Exemplar=1&LAN=DE A1 Wang, Chengwu A1 Kurokawa, Syuhei A1 Doi, Toshiro A1 Yuan, Julong A1 Sano, Yasuhisa A1 Aida, Hideo A1 Zhang, Kehua A1 Deng, Qianfa PB The Electrochemical Society YR 2017 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 6 IS 4 SP P105 OP P112 LK http://dx.doi.org/https://doi.org/10.1149/2.0041704jss DO https://doi.org/10.1149/2.0041704jss SF ELIB - SuUB Bremen
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