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Post Cu CMP Cleaning of Polyurethane Pad Debris:
Tseng, Wei-Tsu
;
Rill, Elliott
;
Backes, Benjamin
...
ECS Journal of Solid State Science and Technology. 3 (2013) 1 - p. N3023-N3031 , 2013
Link:
https://doi.org/10.1149/2.006401jss
RT Journal T1 <Title>Post Cu CMP Cleaning of Polyurethane Pad Debris</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.006401jss&Exemplar=1&LAN=DE A1 Tseng, Wei-Tsu A1 Rill, Elliott A1 Backes, Benjamin A1 Chace, Mark A1 Yao, Yiping A1 DeHaven, Patrick A1 Ticknor, Adam A1 Devarapalli, Vamsi A1 Khojasteh, Mahmoud A1 Steber, David A1 Economikos, Laertis A1 Truong, Connie A1 Majors, Christopher PB The Electrochemical Society YR 2013 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 3 IS 1 SP N3023 OP N3031 LK http://dx.doi.org/https://doi.org/10.1149/2.006401jss DO https://doi.org/10.1149/2.006401jss SF ELIB - SuUB Bremen
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