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1 Ergebnisse
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Material Removal Mechanism during Copper Chemical Mechanica..:
Choi, Seungchoun
;
Doyle, Fiona M.
;
Dornfeld, David A.
ECS Journal of Solid State Science and Technology. 6 (2017) 5 - p. P235-P242 , 2017
Link:
https://doi.org/10.1149/2.0071705jss
RT Journal T1 <Title>Material Removal Mechanism during Copper Chemical Mechanical Planarization Based on Nano-Scale Material Behavior</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0071705jss&Exemplar=1&LAN=DE A1 Choi, Seungchoun A1 Doyle, Fiona M. A1 Dornfeld, David A. PB The Electrochemical Society YR 2017 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 6 IS 5 SP P235 OP P242 LK http://dx.doi.org/https://doi.org/10.1149/2.0071705jss DO https://doi.org/10.1149/2.0071705jss SF ELIB - SuUB Bremen
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