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1 Ergebnisse
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Advanced Cu Interconnection via Electroless-Plated Ni Inter..:
Nam, Seung Hee
;
Moon, Tae Hyoung
;
Lee, Kyu Whang
...
ECS Journal of Solid State Science and Technology. 3 (2014) 10 - p. Q190-Q194 , 2014
Link:
https://doi.org/10.1149/2.00814410jss
RT Journal T1 <Title>Advanced Cu Interconnection via Electroless-Plated Ni Interlayer on the Gate of Oxide Thin-Film Transistors</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.00814410jss&Exemplar=1&LAN=DE A1 Nam, Seung Hee A1 Moon, Tae Hyoung A1 Lee, Kyu Whang A1 Lee, Kyoung Ha A1 Yoo, Soon Sung A1 Shin, Woo Sup A1 Yang, Myoung Su A1 Im, Seongil PB The Electrochemical Society YR 2014 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 3 IS 10 SP Q190 OP Q194 LK http://dx.doi.org/https://doi.org/10.1149/2.00814410jss DO https://doi.org/10.1149/2.00814410jss SF ELIB - SuUB Bremen
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