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1 Ergebnisse
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Voiding Phenomena in Copper-Copper Bonded Structures: Role ..:
Gondcharton, P.
;
Imbert, B.
;
Benaissa, L.
.
ECS Journal of Solid State Science and Technology. 4 (2015) 3 - p. P77-P82 , 2015
Link:
https://doi.org/10.1149/2.0081503jss
RT Journal T1 <Title>Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0081503jss&Exemplar=1&LAN=DE A1 Gondcharton, P. A1 Imbert, B. A1 Benaissa, L. A1 Verdier, M. PB The Electrochemical Society YR 2015 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 4 IS 3 SP P77 OP P82 LK http://dx.doi.org/https://doi.org/10.1149/2.0081503jss DO https://doi.org/10.1149/2.0081503jss SF ELIB - SuUB Bremen
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