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1 Ergebnisse
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Observation of the Behavior of Additives in Copper Electrop..:
Akita, Takanori
;
Tomie, Mineyoshi
;
Ikuta, Ryo
..
Journal of The Electrochemical Society. 166 (2018) 1 - p. D3058-D3065 , 2018
Link:
https://doi.org/10.1149/2.0081901jes
RT Journal T1 <Title>Observation of the Behavior of Additives in Copper Electroplating Using a Microfluidic Device</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0081901jes&Exemplar=1&LAN=DE A1 Akita, Takanori A1 Tomie, Mineyoshi A1 Ikuta, Ryo A1 Egoshi, Haruki A1 Hayase, Masanori PB The Electrochemical Society YR 2018 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 166 IS 1 SP D3058 OP D3065 LK http://dx.doi.org/https://doi.org/10.1149/2.0081901jes DO https://doi.org/10.1149/2.0081901jes SF ELIB - SuUB Bremen
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