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1 Ergebnisse
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Microvia Filling with Copper Electroplated with Quaternary ..:
Lee, Myung Hyun
;
Lee, Yoonjae
;
Oh, Jung Hwan
...
Journal of The Electrochemical Society. 164 (2017) 14 - p. D1051-D1055 , 2017
Link:
https://doi.org/10.1149/2.0121802jes
RT Journal T1 <Title>Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0121802jes&Exemplar=1&LAN=DE A1 Lee, Myung Hyun A1 Lee, Yoonjae A1 Oh, Jung Hwan A1 Kim, Young Gyu A1 Cho, Sung Ki A1 Kim, Jae Jeong PB The Electrochemical Society YR 2017 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 164 IS 14 SP D1051 OP D1055 LK http://dx.doi.org/https://doi.org/10.1149/2.0121802jes DO https://doi.org/10.1149/2.0121802jes SF ELIB - SuUB Bremen
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