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A Water Polishing Process to Improve Ceria Abrasive Removal:
Hong, Seokjun
;
Kim, Juhwan
;
Won, Johee
...
ECS Journal of Solid State Science and Technology. 8 (2019) 8 - p. P430-P436 , 2019
Link:
https://doi.org/10.1149/2.0171908jss
RT Journal T1 <Title>A Water Polishing Process to Improve Ceria Abrasive Removal</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0171908jss&Exemplar=1&LAN=DE A1 Hong, Seokjun A1 Kim, Juhwan A1 Won, Johee A1 Qureshi, Nilam A1 Chae, Seungki A1 Wada, Yutaka A1 Hiyama, Hirokuni A1 Hamada, Satomi A1 Kim, Taesung PB The Electrochemical Society YR 2019 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 8 IS 8 SP P430 OP P436 LK http://dx.doi.org/https://doi.org/10.1149/2.0171908jss DO https://doi.org/10.1149/2.0171908jss SF ELIB - SuUB Bremen
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