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1 Ergebnisse
1
Through-Hole Filling in a Cu Plating Bath with Functional I..:
Lin, Yu-Tien
;
Wang, Mei-Ling
;
Hsu, Chia-Fu
...
Journal of The Electrochemical Society. 160 (2013) 12 - p. D3149-D3153 , 2013
Link:
https://doi.org/10.1149/2.025312jes
RT Journal T1 <Title>Through-Hole Filling in a Cu Plating Bath with Functional Insoluble Anodes and Acetic Acid as a Supporting Electrolyte</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.025312jes&Exemplar=1&LAN=DE A1 Lin, Yu-Tien A1 Wang, Mei-Ling A1 Hsu, Chia-Fu A1 Dow, Wei-Ping A1 Lin, Shih-Min A1 Yang, Jian-Jun PB The Electrochemical Society YR 2013 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 160 IS 12 SP D3149 OP D3153 LK http://dx.doi.org/https://doi.org/10.1149/2.025312jes DO https://doi.org/10.1149/2.025312jes SF ELIB - SuUB Bremen
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