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1 Ergebnisse
1
Direct Cu Electrodeposition on Electroless Deposited NiWP B..:
Kim, Kwang Hwan
;
Lim, Taeho
;
Kim, Myung Jun
...
Journal of The Electrochemical Society. 161 (2014) 14 - p. D756-D760 , 2014
Link:
https://doi.org/10.1149/2.0291414jes
RT Journal T1 <Title>Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2Substrate for All-Wet Metallization Process</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0291414jes&Exemplar=1&LAN=DE A1 Kim, Kwang Hwan A1 Lim, Taeho A1 Kim, Myung Jun A1 Choe, Seunghoe A1 Park, Kyung Ju A1 Ahn, Sang Hyun A1 Kwon, Oh Joong A1 Kim, Jae Jeong PB The Electrochemical Society YR 2014 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 161 IS 14 SP D756 OP D760 LK http://dx.doi.org/https://doi.org/10.1149/2.0291414jes DO https://doi.org/10.1149/2.0291414jes SF ELIB - SuUB Bremen
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