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1 Ergebnisse
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Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Lay..:
Kelly, J.
;
Lin, X.
;
Nogami, T.
...
Journal of The Electrochemical Society. 160 (2013) 12 - p. D3171-D3178 , 2013
Link:
https://doi.org/10.1149/2.031312jes
RT Journal T1 <Title>Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.031312jes&Exemplar=1&LAN=DE A1 Kelly, J. A1 Lin, X. A1 Nogami, T. A1 van der Straten, O. A1 Demarest, J. A1 Li, J. A1 Murphy, R. A1 Zhang, X. A1 Penny, C. A1 Parks, C. A1 Edelstein, D. PB The Electrochemical Society YR 2013 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 160 IS 12 SP D3171 OP D3178 LK http://dx.doi.org/https://doi.org/10.1149/2.031312jes DO https://doi.org/10.1149/2.031312jes SF ELIB - SuUB Bremen
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