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1 Ergebnisse
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Inhibition Effect of CTAB on Electrodeposition of Cu in Mic..:
Wu, Houya
;
Li, Zhiyi
;
Wang, Yan
..
Journal of The Electrochemical Society. 166 (2019) 15 - p. D816-D825 , 2019
Link:
https://doi.org/10.1149/2.0651915jes
RT Journal T1 <Title>Inhibition Effect of CTAB on Electrodeposition of Cu in Micro Via: Experimental and MD Simulation Investigations</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0651915jes&Exemplar=1&LAN=DE A1 Wu, Houya A1 Li, Zhiyi A1 Wang, Yan A1 Li, Xiang A1 Zhu, Wenhui PB The Electrochemical Society YR 2019 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 166 IS 15 SP D816 OP D825 LK http://dx.doi.org/https://doi.org/10.1149/2.0651915jes DO https://doi.org/10.1149/2.0651915jes SF ELIB - SuUB Bremen
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