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Stress and Strain Evolution in Electroless Copper Films Eva..:
Sharma, Tanu
;
Brüning, Ralf
;
Brown, Colby
...
Journal of The Electrochemical Society. 160 (2013) 6 - p. D226-D232 , 2013
Link:
https://doi.org/10.1149/2.066306jes
RT Journal T1 <Title>Stress and Strain Evolution in Electroless Copper Films Evaluated with X-ray Diffraction and Substrate Curvature</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.066306jes&Exemplar=1&LAN=DE A1 Sharma, Tanu A1 Brüning, Ralf A1 Brown, Colby A1 Sibley, Allison A1 Etzkorn, Johannes A1 Stamp, Lutz PB The Electrochemical Society YR 2013 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 160 IS 6 SP D226 OP D232 LK http://dx.doi.org/https://doi.org/10.1149/2.066306jes DO https://doi.org/10.1149/2.066306jes SF ELIB - SuUB Bremen
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