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1 Ergebnisse
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Direct Copper Pattern Plating on Glass and Ceramic Substrat..:
Cheng, Chia-Wen
;
Chan, Po-Fan
;
Dow, Wei-Ping
Journal of The Electrochemical Society. 164 (2017) 12 - p. D687-D693 , 2017
Link:
https://doi.org/10.1149/2.0721712jes
RT Journal T1 <Title>Direct Copper Pattern Plating on Glass and Ceramic Substrates Using an Al-Doped ZnO as an Adhesive and Conducting Layer</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.0721712jes&Exemplar=1&LAN=DE A1 Cheng, Chia-Wen A1 Chan, Po-Fan A1 Dow, Wei-Ping PB The Electrochemical Society YR 2017 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 164 IS 12 SP D687 OP D693 LK http://dx.doi.org/https://doi.org/10.1149/2.0721712jes DO https://doi.org/10.1149/2.0721712jes SF ELIB - SuUB Bremen
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