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1 Ergebnisse
1
High-Speed Cu Electrodeposition and Reliability of Cu Pilla..:
Lee, P. T.
;
Wu, Y. S.
;
Lee, C. Y.
..
Journal of The Electrochemical Society. 165 (2018) 13 - p. D647-D653 , 2018
Link:
https://doi.org/10.1149/2.1001813jes
RT Journal T1 <Title>High-Speed Cu Electrodeposition and Reliability of Cu Pillar Bumps in High-Temperature Storage</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.1001813jes&Exemplar=1&LAN=DE A1 Lee, P. T. A1 Wu, Y. S. A1 Lee, C. Y. A1 Liu, H. C. A1 Ho, C. E. PB The Electrochemical Society YR 2018 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 165 IS 13 SP D647 OP D653 LK http://dx.doi.org/https://doi.org/10.1149/2.1001813jes DO https://doi.org/10.1149/2.1001813jes SF ELIB - SuUB Bremen
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