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Adhesion Enhancement of a Plated Copper Layer on an AlN Sub..:
Shen, Shao-Ping
;
Dow, Wei-Ping
Journal of The Electrochemical Society. 161 (2014) 10 - p. D579-D585 , 2014
Link:
https://doi.org/10.1149/2.1061410jes
RT Journal T1 <Title>Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.1061410jes&Exemplar=1&LAN=DE A1 Shen, Shao-Ping A1 Dow, Wei-Ping PB The Electrochemical Society YR 2014 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 161 IS 10 SP D579 OP D585 LK http://dx.doi.org/https://doi.org/10.1149/2.1061410jes DO https://doi.org/10.1149/2.1061410jes SF ELIB - SuUB Bremen
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