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1 Ergebnisse
1
Self-Annealing Behavior of Electroplated Cu in Blind-Hole S..:
Yang, Cheng-Hsien
;
Lee, Yu-Wei
;
Lee, Cheng-Yu
..
Journal of The Electrochemical Society. 166 (2019) 13 - p. D683-D688 , 2019
Link:
https://doi.org/10.1149/2.1301913jes
RT Journal T1 <Title>Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2.1301913jes&Exemplar=1&LAN=DE A1 Yang, Cheng-Hsien A1 Lee, Yu-Wei A1 Lee, Cheng-Yu A1 Chang, Chih-Hao A1 Ho, Cheng-En PB The Electrochemical Society YR 2019 SN 0013-4651 SN 1945-7111 JF Journal of The Electrochemical Society VO 166 IS 13 SP D683 OP D688 LK http://dx.doi.org/https://doi.org/10.1149/2.1301913jes DO https://doi.org/10.1149/2.1301913jes SF ELIB - SuUB Bremen
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