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Experimental and Modelling Investigation of Re-Adhesion Mec..:
Handa, N.
;
Hiyama, H.
;
Amagai, K.
.
ECS Journal of Solid State Science and Technology. 9 (2020) 6 - p. 064001 , 2020
Link:
https://doi.org/10.1149/2162-8777/ab9fe9
RT Journal T1 <Title>Experimental and Modelling Investigation of Re-Adhesion Mechanism of Detached Nanoparticles to Wafer Surface in Spin Rinse Process</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_ab9fe9&Exemplar=1&LAN=DE A1 Handa, N. A1 Hiyama, H. A1 Amagai, K. A1 Yano, A. PB The Electrochemical Society YR 2020 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 9 IS 6 SP 064001 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/ab9fe9 DO https://doi.org/10.1149/2162-8777/ab9fe9 SF ELIB - SuUB Bremen
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