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1 Ergebnisse
1
High TEC Copper to Connect Copper Bond Pads for Low Tempera..:
Tran, Anh Van Nhat
;
Hirato, Tetsuji
;
Kondo, Kazuo
ECS Journal of Solid State Science and Technology. 9 (2020) 12 - p. 124003 , 2020
Link:
https://doi.org/10.1149/2162-8777/abd14a
RT Journal T1 <Title>High TEC Copper to Connect Copper Bond Pads for Low Temperature Wafer Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_abd14a&Exemplar=1&LAN=DE A1 Tran, Anh Van Nhat A1 Hirato, Tetsuji A1 Kondo, Kazuo PB The Electrochemical Society YR 2020 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 9 IS 12 SP 124003 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/abd14a DO https://doi.org/10.1149/2162-8777/abd14a SF ELIB - SuUB Bremen
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