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1 Ergebnisse
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Soft Chemical Mechanical Polishing Pad for Oxide CMP Applic..:
Kenchappa, N. B.
;
Popuri, Ramtej
;
Chockkalingam, Ashwin
...
ECS Journal of Solid State Science and Technology. 10 (2021) 1 - p. 014008 , 2021
Link:
https://doi.org/10.1149/2162-8777/abdc40
RT Journal T1 <Title>Soft Chemical Mechanical Polishing Pad for Oxide CMP Applications</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_abdc40&Exemplar=1&LAN=DE A1 Kenchappa, N. B. A1 Popuri, Ramtej A1 Chockkalingam, Ashwin A1 Jawali, Puneet A1 Jayanath, Shiyan A1 Redfield, Daniel A1 Bajaj, Rajeev PB The Electrochemical Society YR 2021 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 10 IS 1 SP 014008 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/abdc40 DO https://doi.org/10.1149/2162-8777/abdc40 SF ELIB - SuUB Bremen
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