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1 Ergebnisse
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Effect of Compressive Stress on Evolution and Healing Kinet..:
Wu, YewChung Sermon
;
Li, Meiyi
;
Lai, Tung-Yen
...
ECS Journal of Solid State Science and Technology. 10 (2021) 4 - p. 044004 , 2021
Link:
https://doi.org/10.1149/2162-8777/abf16b
RT Journal T1 <Title>Effect of Compressive Stress on Evolution and Healing Kinetics of Artificial Voids in Highly (111)-Oriented Cu-Cu Wafer Bonding at 300 °C</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_abf16b&Exemplar=1&LAN=DE A1 Wu, YewChung Sermon A1 Li, Meiyi A1 Lai, Tung-Yen A1 Lu, Tsan-Feng A1 Wang, Yu Hsiang A1 Chang, Jiun-Wei PB The Electrochemical Society YR 2021 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 10 IS 4 SP 044004 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/abf16b DO https://doi.org/10.1149/2162-8777/abf16b SF ELIB - SuUB Bremen
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