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1 Ergebnisse
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Effect of Solder Particle Size on the Mechanical and Therma..:
Xinmeng, Zhai
;
Yue, Chen
;
Li, Yuefeng
...
ECS Journal of Solid State Science and Technology. 10 (2021) 4 - p. 044007 , 2021
Link:
https://doi.org/10.1149/2162-8777/abf517
RT Journal T1 <Title>Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_abf517&Exemplar=1&LAN=DE A1 Xinmeng, Zhai A1 Yue, Chen A1 Li, Yuefeng A1 Jun, Zou A1 Mingming, Shi A1 Bobo, Yang A1 Yang, Li A1 Chunfeng, Guo A1 Rongrong, Hu A1 Qinglou, Cao PB The Electrochemical Society YR 2021 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 10 IS 4 SP 044007 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/abf517 DO https://doi.org/10.1149/2162-8777/abf517 SF ELIB - SuUB Bremen
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