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Evolution Kinetics of Voids in Electroplated Cu-Cu Wafer Bo..:
Lai, Tung-Yen
;
Li, Meiyi
;
Tseng, Tzu Yen
...
ECS Journal of Solid State Science and Technology. 10 (2021) 6 - p. 064009 , 2021
Link:
https://doi.org/10.1149/2162-8777/ac08d3
RT Journal T1 <Title>Evolution Kinetics of Voids in Electroplated Cu-Cu Wafer Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_ac08d3&Exemplar=1&LAN=DE A1 Lai, Tung-Yen A1 Li, Meiyi A1 Tseng, Tzu Yen A1 Lin, Tzu-Chen A1 Lu, Tsan-Feng A1 Wu, YewChung Sermon PB The Electrochemical Society YR 2021 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 10 IS 6 SP 064009 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/ac08d3 DO https://doi.org/10.1149/2162-8777/ac08d3 SF ELIB - SuUB Bremen
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