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Review—Hybrid Bonding-Based Interconnects: A Status on the ..:
Moreau, S.
;
Jourdon, J.
;
Lhostis, S.
...
ECS Journal of Solid State Science and Technology. 11 (2022) 2 - p. 024001 , 2022
Link:
https://doi.org/10.1149/2162-8777/ac4ffe
RT Journal T1 <Title>Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_ac4ffe&Exemplar=1&LAN=DE A1 Moreau, S. A1 Jourdon, J. A1 Lhostis, S. A1 Bouchu, D. A1 Ayoub, B. A1 Arnaud, L. A1 Frémont, H. PB The Electrochemical Society YR 2022 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 11 IS 2 SP 024001 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/ac4ffe DO https://doi.org/10.1149/2162-8777/ac4ffe SF ELIB - SuUB Bremen
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