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Analytical Modelling of Material Removal in Copper Chemical..:
Sharma, Mohit
;
Chen, Chao-Chang A.
ECS Journal of Solid State Science and Technology. 11 (2022) 4 - p. 044007 , 2022
Link:
https://doi.org/10.1149/2162-8777/ac6624
RT Journal T1 <Title>Analytical Modelling of Material Removal in Copper Chemical Mechanical Polishing Incorporating the Scratch Hardness of the Passivated Layer on Copper Thin Film Wafer</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_ac6624&Exemplar=1&LAN=DE A1 Sharma, Mohit A1 Chen, Chao-Chang A. PB The Electrochemical Society YR 2022 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 11 IS 4 SP 044007 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/ac6624 DO https://doi.org/10.1149/2162-8777/ac6624 SF ELIB - SuUB Bremen
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