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Void Formation Mechanism Related to Particles During Wafer-..:
Nagano, F.
;
Iacovo, S.
;
Phommahaxay, A.
...
ECS Journal of Solid State Science and Technology. 11 (2022) 6 - p. 063012 , 2022
Link:
https://doi.org/10.1149/2162-8777/ac7662
RT Journal T1 <Title>Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_ac7662&Exemplar=1&LAN=DE A1 Nagano, F. A1 Iacovo, S. A1 Phommahaxay, A. A1 Inoue, F. A1 Chancerel, F. A1 Naser, H. A1 Beyer, G. A1 Beyne, E. A1 De. Gendt, S. PB The Electrochemical Society YR 2022 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 11 IS 6 SP 063012 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/ac7662 DO https://doi.org/10.1149/2162-8777/ac7662 SF ELIB - SuUB Bremen
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