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Characterization of Pad–Wafer Contact Area and Distance in ..:
Schumacher-Härtwig, Henrik
ECS Journal of Solid State Science and Technology. 12 (2023) 7 - p. 074002 , 2023
Link:
https://doi.org/10.1149/2162-8777/acdffb
RT Journal T1 <Title>Characterization of Pad–Wafer Contact Area and Distance in Chemical-Mechanical Polishing</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_acdffb&Exemplar=1&LAN=DE A1 Schumacher-Härtwig, Henrik PB The Electrochemical Society YR 2023 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 12 IS 7 SP 074002 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/acdffb DO https://doi.org/10.1149/2162-8777/acdffb SF ELIB - SuUB Bremen
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