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Development of Novel Conditioning Method Using Thermal Shap..:
Seo, Jangwon
;
Jeon, Sanghuck
;
Yoon, Jongwook
...
ECS Journal of Solid State Science and Technology. 13 (2024) 3 - p. 034003 , 2024
Link:
https://doi.org/10.1149/2162-8777/ad2cfc
RT Journal T1 <Title>Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_ad2cfc&Exemplar=1&LAN=DE A1 Seo, Jangwon A1 Jeon, Sanghuck A1 Yoon, Jongwook A1 An, Joonho A1 Choi, Yongsoo A1 Seok, Hyunho A1 Lee, Seunghwan A1 Liu, Pengzhan A1 Jeon, Wookyung A1 Kim, Taesung PB The Electrochemical Society YR 2024 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 13 IS 3 SP 034003 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/ad2cfc DO https://doi.org/10.1149/2162-8777/ad2cfc SF ELIB - SuUB Bremen
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