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1 Ergebnisse
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Kinetic Modeling and Material Removal Mechanism Analysis of..:
Hang, Wei
;
Ye, Jiahao
;
Chen, Hongyu
...
ECS Journal of Solid State Science and Technology. 13 (2024) 4 - p. 044005 , 2024
Link:
https://doi.org/10.1149/2162-8777/ad384c
RT Journal T1
Kinetic Modeling and Material Removal Mechanism Analysis of Fixed-Abrasive Polishing for Lithium Tantalite Wafer
UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_2162-8777_ad384c&Exemplar=1&LAN=DE A1 Hang, Wei A1 Ye, Jiahao A1 Chen, Hongyu A1 Yuan, Julong A1 Li, Yong A1 Zhu, Weijun A1 Cui, Kun A1 Song, Wei A1 Shi, Xuxia PB The Electrochemical Society YR 2024 SN 2162-8769 SN 2162-8777 JF ECS Journal of Solid State Science and Technology VO 13 IS 4 SP 044005 LK http://dx.doi.org/https://doi.org/10.1149/2162-8777/ad384c DO https://doi.org/10.1149/2162-8777/ad384c SF ELIB - SuUB Bremen
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