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Comparison of H2and NH3Treatments for Copper Interconnects:
Chang, Yu-Min
;
Leu, Jihperng
;
Lin, Bing-Hong
..
Advances in Materials Science and Engineering. 2013 (2013) - p. 1-7 , 2013
Link:
https://doi.org/10.1155/2013/825195
RT Journal T1 <Title>Comparison of H2and NH3Treatments for Copper Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1155_2013_825195&Exemplar=1&LAN=DE A1 Chang, Yu-Min A1 Leu, Jihperng A1 Lin, Bing-Hong A1 Wang, Ying-Lung A1 Cheng, Yi-Lung PB Hindawi Limited YR 2013 SN 1687-8434 SN 1687-8442 JF Advances in Materials Science and Engineering VO 2013 SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1155/2013/825195 DO https://doi.org/10.1155/2013/825195 SF ELIB - SuUB Bremen
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