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1 Ergebnisse
1
Experimental and Numerical Analysis of the Thermal Conducti..:
Mi, Zhaoguo
;
Chen, Zhenhua
;
Yang, Weihua
.
Advances in Materials Science and Engineering. 2023 (2023) - p. 1-11 , 2023
Link:
https://doi.org/10.1155/2023/6522013
RT Journal T1 <Title>Experimental and Numerical Analysis of the Thermal Conductivity of SiCf/SiC Composites</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1155_2023_6522013&Exemplar=1&LAN=DE A1 Mi, Zhaoguo A1 Chen, Zhenhua A1 Yang, Weihua A1 Nawab, Yasir PB Hindawi Limited YR 2023 SN 1687-8442 SN 1687-8434 JF Advances in Materials Science and Engineering VO 2023 SP 1 OP 11 LK http://dx.doi.org/https://doi.org/10.1155/2023/6522013 DO https://doi.org/10.1155/2023/6522013 SF ELIB - SuUB Bremen
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