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On the mechanism of popcorn blistering in copper clad lamin..:
Seol, Kyeong-Won
;
Choi, Chang-Hee
;
Kim, Sangyum
..
Journal of Adhesion Science and Technology. 17 (2003) 10 - p. 1331-1349 , 2003
Link:
https://doi.org/10.1163/156856103769172779
RT Journal T1 <Title>On the mechanism of popcorn blistering in copper clad laminates</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1163_156856103769172779&Exemplar=1&LAN=DE A1 Seol, Kyeong-Won A1 Choi, Chang-Hee A1 Kim, Sangyum A1 Son, Seong Ho A1 Lee, Jong K. PB Informa UK Limited YR 2003 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology VO 17 IS 10 SP 1331 OP 1349 LK http://dx.doi.org/https://doi.org/10.1163/156856103769172779 DO https://doi.org/10.1163/156856103769172779 SF ELIB - SuUB Bremen
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