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In situ cure monitoring of adhesively bonded joints by diel..:
Kwon, Jae Wook
;
Chin, Woo Seok
;
Lee, Dai Gil
Journal of Adhesion Science and Technology. 17 (2003) 16 - p. 2111-2130 , 2003
Link:
https://doi.org/10.1163/156856103772150733
RT Journal T1 <Title>In situ cure monitoring of adhesively bonded joints by dielectrometry</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1163_156856103772150733&Exemplar=1&LAN=DE A1 Kwon, Jae Wook A1 Chin, Woo Seok A1 Lee, Dai Gil PB Informa UK Limited YR 2003 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology VO 17 IS 16 SP 2111 OP 2130 LK http://dx.doi.org/https://doi.org/10.1163/156856103772150733 DO https://doi.org/10.1163/156856103772150733 SF ELIB - SuUB Bremen
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