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Application of a Genetic Algorithm Associated With Adhesive..:
Cheng, Tung-Hua
;
Tseng, Ching-Huan
;
Hung, Ching-Hua
Journal of Adhesion Science and Technology. 22 (2008) 10-11 - p. 1057-1072 , 2008
Link:
https://doi.org/10.1163/156856108x305921
RT Journal T1 <Title>Application of a Genetic Algorithm Associated With Adhesive Joint Analysis to the IC Chip Pick-up Process</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1163_156856108x305921&Exemplar=1&LAN=DE A1 Cheng, Tung-Hua A1 Tseng, Ching-Huan A1 Hung, Ching-Hua PB Informa UK Limited YR 2008 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology VO 22 IS 10-11 SP 1057 OP 1072 LK http://dx.doi.org/https://doi.org/10.1163/156856108x305921 DO https://doi.org/10.1163/156856108x305921 SF ELIB - SuUB Bremen
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