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Assessment of Adhesion of Electroplated Cu and Multilayered..:
Zhu, Yongkui
;
Yu, Zhiming
;
Niu, Yunsong
.
Journal of Adhesion Science and Technology. 26 (2012) 10-11 - p. 1645-1652 , 2012
Link:
https://doi.org/10.1163/156856111x618461
RT Journal T1 <Title>Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1163_156856111x618461&Exemplar=1&LAN=DE A1 Zhu, Yongkui A1 Yu, Zhiming A1 Niu, Yunsong A1 Ding, Wenjiang PB Informa UK Limited YR 2012 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology VO 26 IS 10-11 SP 1645 OP 1652 LK http://dx.doi.org/https://doi.org/10.1163/156856111x618461 DO https://doi.org/10.1163/156856111x618461 SF ELIB - SuUB Bremen
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