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Linear growth behaviour of intermetallic compound layer in ..:
Bakar, Maria Abu
;
Jalar, Azman
;
Alias, Anuar
Science and Technology of Welding and Joining. 29 (2024) 1 - p. 38-46 , 2024
Link:
https://doi.org/10.1177/13621718231216379
RT Journal T1 <Title>Linear growth behaviour of intermetallic compound layer in electronic interconnections</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1177_13621718231216379&Exemplar=1&LAN=DE A1 Bakar, Maria Abu A1 Jalar, Azman A1 Alias, Anuar PB SAGE Publications YR 2024 SN 1362-1718 SN 1743-2936 JF Science and Technology of Welding and Joining VO 29 IS 1 SP 38 OP 46 LK http://dx.doi.org/https://doi.org/10.1177/13621718231216379 DO https://doi.org/10.1177/13621718231216379 SF ELIB - SuUB Bremen
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