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Ultra-precision grinding of 4H-SiC wafer by PAV/PF composit..:
Feng, Kaiping
;
Zhao, Tianchen
;
Lyu, Binghai
.
Advances in Mechanical Engineering. 13 (2021) 9 - p. 168781402110449 , 2021
Link:
https://doi.org/10.1177/16878140211044929
RT Journal T1 <Title>Ultra-precision grinding of 4H-SiC wafer by PAV/PF composite sol-gel diamond wheel</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1177_16878140211044929&Exemplar=1&LAN=DE A1 Feng, Kaiping A1 Zhao, Tianchen A1 Lyu, Binghai A1 Zhou, Zhaozhong PB SAGE Publications YR 2021 SN 1687-8140 SN 1687-8140 JF Advances in Mechanical Engineering VO 13 IS 9 SP 168781402110449 LK http://dx.doi.org/https://doi.org/10.1177/16878140211044929 DO https://doi.org/10.1177/16878140211044929 SF ELIB - SuUB Bremen
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