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1 Ergebnisse
1
Low-temperature smoothing method of scalloped DRIE trench b..:
Park, Jin Soo
;
Kang, Dong-Hyun
;
Kwak, Seung Min
...
Micro and Nano Systems Letters. 8 (2020) 1 - p. , 2020
Link:
https://doi.org/10.1186/s40486-020-00116-x
RT Journal T1
Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma
UL https://suche.suub.uni-bremen.de/peid=cr-10.1186_s40486-020-00116-x&Exemplar=1&LAN=DE A1 Park, Jin Soo A1 Kang, Dong-Hyun A1 Kwak, Seung Min A1 Kim, Tae Song A1 Park, Jung Ho A1 Kim, Tae Geun A1 Baek, Seung-Hyub A1 Lee, Byung Chul PB Springer Science and Business Media LLC YR 2020 SN 2213-9621 JF Micro and Nano Systems Letters VO 8 IS 1 LK http://dx.doi.org/https://doi.org/10.1186/s40486-020-00116-x DO https://doi.org/10.1186/s40486-020-00116-x SF ELIB - SuUB Bremen
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