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1 Ergebnisse
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Temperature-leveling performance comparison of solid–solid ..:
BABA, Masaaki
;
ISHIHARAJIMA, Hiroaki
;
ISHISAKA, Koki
..
Journal of Thermal Science and Technology. 19 (2024) 1 - p. 24-00014-24-00014 , 2024
Link:
https://doi.org/10.1299/jtst.24-00014
RT Journal T1 <Title>Temperature-leveling performance comparison of solid–solid phase change materials for thermal management of electronic chips in thin devices</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1299_jtst.24-00014&Exemplar=1&LAN=DE A1 BABA, Masaaki A1 ISHIHARAJIMA, Hiroaki A1 ISHISAKA, Koki A1 YAMADA, Noboru A1 TAKEDA, Masatoshi PB Japan Society of Mechanical Engineers YR 2024 SN 1880-5566 JF Journal of Thermal Science and Technology VO 19 IS 1 SP 24 OP 00014-24-00014 LK http://dx.doi.org/https://doi.org/10.1299/jtst.24-00014 DO https://doi.org/10.1299/jtst.24-00014 SF ELIB - SuUB Bremen
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