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1 Ergebnisse
1
Thermal dissipation enhancement in flip-chip bondeduni-trav..:
bai, Junwu
;
Shen, Yang
;
Yao, Peng
...
Optics Letters. , 2023
Link:
https://doi.org/10.1364/ol.501224
RT Journal T1
Thermal dissipation enhancement in flip-chip bondeduni-traveling carriers photodiodes
UL https://suche.suub.uni-bremen.de/peid=cr-10.1364_ol.501224&Exemplar=1&LAN=DE A1 bai, Junwu A1 Shen, Yang A1 Yao, Peng A1 Chen, Dekang A1 Konkol, Matthew A1 Guo, Bingtian A1 Guo, Xiangwen A1 Carey, Victoria A1 Campbell, Joe A1 Prather, Dennis PB Optica Publishing Group YR 2023 SN 0146-9592 SN 1539-4794 JF Optics Letters LK http://dx.doi.org/https://doi.org/10.1364/ol.501224 DO https://doi.org/10.1364/ol.501224 SF ELIB - SuUB Bremen
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