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A New Model for Temperature Jump at a Fluid-Solid Interface:
Shu, Jian-Jun
;
Teo, Ji Bin Melvin
;
Chan, Weng Kong
.
PLOS ONE. 11 (2016) 10 - p. e0165175 , 2016
Link:
https://doi.org/10.1371/journal.pone.0165175
RT Journal T1
A New Model for Temperature Jump at a Fluid-Solid Interface
UL https://suche.suub.uni-bremen.de/peid=cr-10.1371_journal.pone.0165175&Exemplar=1&LAN=DE A1 Shu, Jian-Jun A1 Teo, Ji Bin Melvin A1 Chan, Weng Kong A1 Cao, Bing-Yang PB Public Library of Science (PLoS) YR 2016 SN 1932-6203 JF PLOS ONE VO 11 IS 10 SP e0165175 LK http://dx.doi.org/https://doi.org/10.1371/journal.pone.0165175 DO https://doi.org/10.1371/journal.pone.0165175 SF ELIB - SuUB Bremen
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