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1 Ergebnisse
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Effect of Copper Line Geometry and Process Parameters on In..:
Zschech, Ehrenfried
;
Blum, Werner
;
Zienert, Inka
.
International Journal of Materials Research. 92 (2022) 7 - p. 803-809 , 2022
Link:
https://doi.org/10.1515/ijmr-2001-0147
RT Journal T1 <Title>Effect of Copper Line Geometry and Process Parameters on Interconnect Microstructure and Degradation Processes</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1515_ijmr-2001-0147&Exemplar=1&LAN=DE A1 Zschech, Ehrenfried A1 Blum, Werner A1 Zienert, Inka A1 Besser, Paul R. PB Walter de Gruyter GmbH YR 2022 SN 2195-8556 SN 1862-5282 JF International Journal of Materials Research VO 92 IS 7 SP 803 OP 809 LK http://dx.doi.org/https://doi.org/10.1515/ijmr-2001-0147 DO https://doi.org/10.1515/ijmr-2001-0147 SF ELIB - SuUB Bremen
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