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Effect of interface strength on electromigration-induced in..:
Zschech, Ehrenfried
;
Engelmann, Hans-Jürgen
;
Meyer, Moritz Andreas
...
International Journal of Materials Research. 96 (2022) 9 - p. 966-971 , 2022
Link:
https://doi.org/10.1515/ijmr-2005-0169
RT Journal T1 <Title>Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1515_ijmr-2005-0169&Exemplar=1&LAN=DE A1 Zschech, Ehrenfried A1 Engelmann, Hans-Jürgen A1 Meyer, Moritz Andreas A1 Kahlert, Volker A1 Vairagar, Anand V. A1 Mhaisalkar, Subodh G. A1 Krishnamoorthy, Ahila A1 Yan, Minyu A1 Tu, K. N. A1 Sukharev, Valeriy PB Walter de Gruyter GmbH YR 2022 SN 2195-8556 SN 1862-5282 JF International Journal of Materials Research VO 96 IS 9 SP 966 OP 971 LK http://dx.doi.org/https://doi.org/10.1515/ijmr-2005-0169 DO https://doi.org/10.1515/ijmr-2005-0169 SF ELIB - SuUB Bremen
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